75 MATERIAL FOR LOW FREQUENCY SUPPRESSION
Fair-Rite has released a new paper with information about Low-Frequency EMI Suppression. Check it out here: Fair-Rite 75 Material Paper.
Solving conductive EMI problems below 5MHz is now easier with our new low frequency suppression cores. Optimized for operation from 100 kHz to 5MHz, our 75 material suppression componentsare available in solid cores as well as our Snap-It split configuration. These low frequency suppression cores are used to suppress common mode EMI on internal and external cable assemblies of electronic equipment at frequencies below 5MHz and have a useful range up to 30 MHz. With significant improvements in low frequency suppression when compared to our 31 material, our 75 material provides even higher impedance at even lower frequencies, requiring fewer turns.
IP67 Connectors as individual as their ambient conditions
Whether they are used in traffic guidance systems, photovoltaic systems, building machinery, supervision cameras or offshore wind farms – modern industrial applications place high demands on the connectors used.
Protection against humidity or mechanical stress are no longer the only significant criteria. Depending on the application, modern connectors have to transmit high currents for energy supply, manage high data rates and contribute to complying with EMC requirements. CONEC’s portfolio is as varied as those requirements:
• IP67 D-Subminiature Solid Body (Standard, High Density)
• IP67 D-Subminiature Combination Solid Body (Standard, High Density)
• IP67 D-Subminiature (Standard, High Density)
• IP67 D-Subminiature Combination (Standard, High Density)
• IP67 D-Subminiature Filter (Standard, High Density
• IP67 Hoods and Accessories
With the Solid Body version of the D-Subminiature connector, CONEC has further optimised the IP67. The housing is made of one piece and therefore offers optimal protection in the vicinity of high mechanical stress.
As a specialist for filter connectors, CONEC has integrated a low pass filter in the interfaces protected against climatic impact as an additional protection against electrical interference. Amongst others, the patented planar filter technology patented by CONEC is used. This technology does not only include a filter for conducted interference, but also provides excellent shielding in the mating area to eliminate interference directly at the interface to the interior device.
GARNER, N.C., December 01, 2011 - CONEC, a manufacturer of high-quality connectors, has developed and expanded its combination mixed layout D-subminiature connector family by adding high density (size 22) signal contact layouts.
"The following high density configurations are now available: 19W1, 15W4 and 45W2, in straight solder pin and solder cup versions," said Peter Persico, technical support specialist at CONEC. "These new configurations provide more flexibility for design engineers who need to get more signal contacts in a small space." Persico noted that other styles are available upon request.
These types of high density connectors save space and are ideal for applications where power, coax and signal contacts are required. Signal contacts can handle up to 3 amps at 60 volts. The power contacts are rated from 10 amps to 40 amps, and coax contacts are available in 50 and 75 Ohm versions. CONEC combination D-subminiature connectors use high reliability gold plated, copper alloy screw machine contacts. Insulator material is UL 94 V-0 rated paired with tin-plated steel housings. Other housing materials are available, such as copper alloy (for non-magnetic applications) or stainless steel (for harsh environment applications). The connectors are ideally suited for applications where high reliability, long life and maximum performance are required.